CAS:123333-67-5
Molecular Formula:H2NaO3P
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Sodium Hypophosphite Monohydrate
Brief Introduction
When used for electroless nickel plating, it is used as the reducing agent of electroplating solution, as the reducing agent in the production of chemical industry and pharmaceutical industry, and also as the raw material for preparing other hypophosphites.
CAS:1338-24-5
Molecular Formula:C7H10O2
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3-(3-Ethylcyclopentyl)Propanoic acid; Naphthenic Acids; Naphtenic Acid; Agenap; Carboxylicacids,Naphthenic; Naphid; Sunapticacidb; 3-Naphthenic Acid
Brief Introduction
It is used as raw material for the production of naphthenate and coating desiccant. It is also used for the anti-corrosion of wood and cables
CAS:14024-11-4
Molecular Formula:AlCl4Li
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Lithium Aluminum Tetrachloride; Lithium Superoxide; Lithium Tetrachloroaluminate; Lithium Peroxide(Li(O2H)) (7Ci,9Ci)
CAS:213697-53-1
Molecular Formula:C26H36NP
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Buchwald'S Davephos Ligand; (2'-Dicyclohexylphosphanyl-Biphenyl-2-Yl)-Dimethyl-Amine; N-[2'-(Dicyclohexylphosphino)-1,1'-Biphenyl-2-Yl]-N,N-Dimethylamine; 2'-(Dicyclohexylphosphino)-N,N-Dimethylbiphenyl-2-Amine; 2-Dimethylamino-2'-(Dicyclohexylphosphino)Biphenyl; 2-[2-(Dicyclohexylphosphanyl)Phenyl]-N,N-Dimethylaniline; 2'-(N,N-Dimethylamino)-2-(Dicyclohexylphosphino)Biphenyl; 2-(3-Methoxypropoxy)-5-Methylaniline; 2'-Dicyclohexylphosphino-2-(N,N-Dimethylamino)Biphenyl; Davephos; 2-Dicyclohexylphosphino-2'-(N,N-Dimethylamino)Biphenyl
Brief Introduction
As a ligand, it is used in Suzuki, Buchwald and other coupling reactions and substitution reactions
CAS:25085-50-1
Molecular Formula:C11H16O2
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Formaldehyde, Polymer With 4-(1,1-Dimethylethyl)Phenol; P-Tertbutylphenolformaldehyde Resin; Alkylphenol Resin; 4-Tert-Butyl Phenol Formaldehyde Resin; Formaldehyde - 4-Tert-Butylphenol (1:1); Para-Tert-Butlyphenol Formaldehyde Resin; Para-Tert-Butyl Phenol Formaldehyde Tackifying Resin; Tert-Butyl-Phenolic Tackifying Resin; 4-Tert-Butylphenol-Formaldehyde Polycondensate
Brief Introduction
It is mainly used in the preparation of ink, paint, adhesive and so on.
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